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MCP6S21/2/6/8
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
E
1
α
c
A
A2
L
β
A1
B1
eB
Units
INCHES*
B
p
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
14
.100
14
2.54
Top to Seating Plane A .140 .155 .170
Molded Package Thickness A2 .115 .130 .145
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .300 .313 .325
Molded Package Width E1 .240 .250 .260
Overall Length D .740 .750 .760
Tip to Seating Plane L .125 .130 .135
3.56 3.94
2.92 3.30
0.38
7.62 7.94
6.10 6.35
18.80 19.05
3.18 3.30
4.32
3.68
8.26
6.60
19.30
3.43
Lead Thickness
c
.008 .012 .015
0.20 0.29
0.38
Upper Lead Width B1 .045 .058 .070
Lower Lead Width B .014 .018 .022
Overall Row Spacing § eB .310 .370 .430
1.14 1.46
0.36 0.46
7.87 9.40
1.78
0.56
10.92
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5 10 15
5 10 15
5 10
5 10
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS21117A-page 34
? 2003 Microchip Technology Inc.
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